Master Bond Polymer System EP21TDCS is a two component, silver filled,
electrically conductive adhesive for high performance bonding and
sealing formulated to cure at room temperature or more rapidly at
elevated temperatures. Unlike the majority of two part silver conductive
epoxy systems, the EP21TDCS has a one-to-one mix ratio, by weight or
volume. It readily develops a high bonding strength of more than 850 psi
tensile shear and a T-peel of greater than 10 pli when measured and
cured at 75°F . It is 100% reactive and does not contain any diluents or
solvents. The volume resistivity of the cured system is less than 10-3
ohm-cm.
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